
Apple‘s next-generation flagship is set to launch officially in the coming months. As we move closer to the debut of the iPhone 18 Pro series, its leaks and rumors continue to gain momentum. Now, a new report claims both the iPhone 18 Pro and the iPhone 18 Pro Max will feature a much larger camera bump compared to their predecessors. The change is reportedly driven by major camera hardware upgrades.
iPhone 18 Pro series will have a larger camera bump due to improved hardware
Early reports have claimed that the iPhone 18 Pro series will feature Apple’s most advanced camera systems yet. The lineup is also tipped to feature a triple 48MP camera setup. It will include a variable-aperture main camera with an upgraded ultra-wide sensor. Moreover, there will be a powerful periscope telephoto along with an improved optical image stabilization technology as well.
The upgraded hardware will improve the photography and videography capabilities by miles. However, they also require more physical space inside the device. This requirement has pushed Apple to make the camera plateau larger on its upcoming iPhone 18 Pro devices. There are multiple reports supporting the claim.
The biggest camera leap in the history of the iPhones
The first sign came from YouTuber Vadim Yuryen, who claimed that the iPhone 18 Pro Max could reach 13.77mm in overall thickness with the camera bump included. For reference, the iPhone 17 Pro Max has an overall thickness value of 12.92mm. The following information was later supported by Digital Chat Station. The tipster said the larger 48MP sensor and variable-aperture technology need additional room.
More recently, the tipster Fixed Focus Digital said that the camera bump of the iPhone 18 Pro could become more than 2mm thicker. Bloomberg’s Mark Gurman recently said the upcoming camera improvements are potentially some of the biggest hardware upgrades in the history of the iPhone. If true, the top-of-the-line iPhones could come really close to the Android photography flagships in terms of optics and imaging.
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