Your next pair of smart glasses or slim smartphone could soon stay cool under heavy AI workloads without getting warm in your hands or buzzing with noisy fans. xMEMS Labs is making that possible by starting mass production of its XMC-2400 and XMC-4800 solid-state micro-cooling chips, designed to pump active airflow inside everyday gadgets without a single moving part.
Microscopic silicon chips replacing noisy fans
Mass production is officially underway for the XMC-2400 and XMC-4800 µCooling chips. This marks the first time solid-state active cooling reaches commercial scale. Built on an all-silicon piezoMEMS architecture, these micro-coolers generate steady, high-pressure airflow without blades or motor bearings. That means zero fan noise, zero mechanical vibration, and extreme reliability in devices where traditional fans would never fit.
Two sizes for wearables, smartphones, and servers
The lineup breaks down into two distinct chips aimed at different hardware needs. The miniature XMC-2400 measures just 7.42 x 9.48 x 1.13 millimeters, outputting up to 28 cubic centimeters of air per second at 1,300 Pa of back pressure while drawing a lightweight 150mW. Its tiny footprint makes it a natural fit for smart glasses, augmented reality light engines, and compact portable storage drives.
For heavier thermal workloads, the larger XMC-4800 steps up to 9.93 x 14.35 x 1.13 millimeters. It pushes up to 48 cubic centimeters of air per second at 1,100 Pa while drawing roughly 240mW. That extra cooling power caters directly to AI-heavy smartphones and server racks in data centers, where targeted airflow can protect components like enterprise SSDs, retimers, and laser modules.
Impressive real-world heat reductions
These chips sit directly next to internal hotspots. So, manufacturers can channel air through tiny micro-drives right where processors and memory generate heat. In real-world testing, xMEMS reports that customers saw chip and system temperature drops between 10 and 25°C across phone hardware, wearables, and storage drives.
Timeline and market launch
According to Mike Housholder, Vice President of Thermal Management at xMEMS, thin mobile devices urgently need active heat removal as on-device AI workloads expand. Traditional cooling methods are simply too bulky or loud for sleek glass frames and thin phones, while data center liquid cooling often ignores secondary components. The company expects the first commercial consumer products featuring the XMC-2400 chip to hit store shelves in early 2027.
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