With every new generation, the chips in our gadgets become more powerful. Look at our smartphones. 2026 ushered in the era of 2nm chips, a massive leap forwards compared to 6-7 years ago. At the same time, because of these advancements, our gadgets have also become increasingly capable as well. As such, sometimes when it comes to sustained performance, things can get a bit hot. But that’s where the xMEMS XMC-2400 and XMC-4800 chips come in.
What are the xMEMS XMC-2400 and XMC-4800?
The xMEMS XMC-2400 is a tiny cooling chip that works like a fan, minus the blades. It runs on piezoMEMS. Interestingly enough, that’s the same silicon technology behind xMEMS’ solid-state speakers.
Instead of spinning blades, the chip creates airflow from silicon alone. There are no bearings to wear down either. xMEMS says that it lets it push air through narrow micro-channels and sit right next to a processor, memory, or storage.
Back in 2024, xMEMS said customers would get samples in early 2025. Now, according to the company, the chip is finally in mass production, along with a bigger sibling called the XMC-4800.
The XMC-2400 measures 7.42 x 9.48mm and is just 1.13mm thick. It moves up to 28 cubic centimeters of air per second and draws about 150mW. It can also hit 1,300 Pa of back pressure. That basically measures how hard a fan can push air through cramped passages.
The XMC-4800 is larger at 9.93 x 14.35mm. It moves up to 48 cubic centimeters per second for about 240mW, but tops out at 1,100 Pa. So the XMC-4800 moves more air, while the XMC-2400 pushes harder.
xMEMS also introduced the XMC-1200 recently, which it built for components inside smart glasses. The company says customers have measured temperature drops ranging between 10 to 25C in glasses, phones, and SSDs.
How will it be utilized?
Smart glasses are the obvious choice for the XMC-2400. Since frames have almost no room for a fan, it makes perfect sense. Who wants a hot device sitting against their face, right? xMEMS expects the first products with the chip to reach the market in early 2027.
Phones come next, and that’s the XMC-4800’s job. You’ve probably felt yours get warm during a long gaming session. Eventually the phone slows itself down to cool off, which is called throttling. Using active cooling should help a phone hold its speed for longer, at least in theory. Both chips also cover SSDs. Drives slow down when they run hot, just like phones do.
That being said, xMEMS hasn’t announced who might be taking advantage of its chips yet. But with all these potential improvements, hopefully more manufacturers will be integrating it into their devices.
The post xMEMS’ Bladeless Cooling Chip Is Finally in Mass Production appeared first on Android Headlines.
