HONOR showed off the Magic 9 Pro Max at the Venice Film Festival earlier this week, and now we’re starting to be bombarded with leaks of the new devices coming from HONOR in the next few months.
Today, we’re seeing a leaked hands-on video from Weibo of the new Magic 9 Pro Max. This shows the green option once again, with the new camera plateau and the round camera module on the left side.
There are markings on the rear camera, which show a 200MP 1/1.28″ sensor with an f/1.57 lens and OIS that corrects up to 3° of deflection. There is also a second 200MP sensor on board that is 1/1.4″ in size for the periscope lens. So we’re looking at potentially two 200MP sensors here, if not three.
HONOR’s new partnership with cinema camera giant ARRI continues here with the Magic 9 Pro Max, following its debut with the Robot Phone. HONOR told us that because ARRI came on board so late, they weren’t able to do a lot with ARRI on the Robot Phone, but the Magic 9 Pro Max could have a lot of ARRI influence, at least on the camera side.
Inside, we are expecting Qualcomm’s new chip that is being announced at Snapdragon Summit later this month, and at least 12GB of RAM. While 16GB would be nice, I don’t see that happening with the current RAM crisis.
The Chinese launch should be happening soon
We don’t yet know when the China launch of the Magic 9 Pro Max will take place, but we can assume it will use the new Snapdragon 8 Elite Gen 6 chips that Qualcomm is announcing at Snapdragon Summit in a couple of weeks. So, it could be announced soon after that.
A global launch will likely be later in the year, if not early in 2027.
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