Qualcomm is officially expanding its IoT silicon portfolio ahead of IFA 2026 with the new Dragonwing Q-2390 and IQ-2390 chips, designed to run on-device AI locally across consumer gadgets and factory hardware. Rather than routing data through distant servers, these new System-on-Chips combine processing, machine vision, and wireless connectivity to help device makers shrink circuit boards, lower manufacturing costs, and speed up product development.
The new lineup features the consumer-facing Dragonwing Q-2390 and the ruggedized Dragonwing IQ-2390. Jeff Arnold, Vice President and General Manager at Qualcomm Technologies, highlighted that while AI is driving a massive shift in connected design, many product categories still hit roadblocks around cost and integration complexity. These new chips aim to solve that by combining features that usually require a messy cluster of separate microchips into a single, clean platform.
Bringing local intelligence to consumer electronics
The Dragonwing Q-2390 is tailored specifically for smart home gear, retail terminals, and consumer appliances where space, thermal limits, and manufacturing budgets are tight. It packs application computing, local AI acceleration, camera inputs, display support, LTE Cat 4 cellular connectivity, GPS location tracking, and hardware-level security onto one board.
That combination means device makers can build smarter fitness equipment, interactive kiosks, access control systems, and home robots that react instantly. Because processing happens locally on the chip, a smart appliance or camera-equipped vacuum can analyze visual feedback and make split-second decisions without freezing up if your home Wi-Fi drops.
Industrial-grade power built for extreme environments
While the consumer chip focuses on daily home life, the Dragonwing IQ-2390 debuts as the first entry in Qualcomm’s new IQ2 Series for factory floors and critical infrastructure. It steps up the specs with machine vision support, advanced industrial automation controls, and dual Gigabit Ethernet featuring Time-Sensitive Networking to keep complex machinery in sync.
To survive real-world working conditions, Qualcomm engineered the IQ-2390 to withstand heavy mechanical shock, intense physical vibration, and extreme operating temperatures ranging from -30°C all the way up to +115°C. That rugged build makes it ideal for oil and gas monitoring, outdoor utility gateways, energy management hardware, and automated manufacturing lines.
Software flexibility and launch roadmap
Under the hood, both platforms feature a quad-core setup with Cortex-A78 and Cortex-A55 application cores branded under the Qualcomm Kryo CPU line, an Adreno 704 GPU, and a real-time RISC-V microcontroller. On the software side, developers get incredible flexibility: the application cores support Android, Yocto Linux, and Ubuntu, while the RISC-V core runs Zephyr RTOS for precise, low-latency tasks.
The upcoming launch of the Qualcomm Dragonwing Q 2390 chip is already making waves. There are System-on-Modules planned to be shown live at IFA 2026. Early-access partners are also testing hardware. Finally, the official developer evaluation kits are set to ship next year.
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