Xiaomi’s in-house XRING O1 debuted last year with the Xiaomi 15S Pro and offered a flagship experience, going head-on with Qualcomm and MediaTek. Since then, there’s been a lot of talk regarding a potential successor, presumably the XRING O3. We’ve come across details regarding its new architectural design in a recent leak. Now, Xiaomi has reportedly confirmed the XRING O3 will officially arrive this year.
Xiaomi’s XRING O3 chip is confirmed to arrive later this year
Xiaomi Group president, Lu Weibing, said that the next XRIG chip, without being specific about its name, will arrive later this year. It’s apparently a “very strong chip,” and it will power a product with “excellent performance” in the near future. As usual, there are no details yet about the new device or the chip, but recent reports have claimed that it’ll power the Xiaomi MIX Fold 5/Xiaomi 17 foldable in China.
As a refresher, the XRING O1 was fabricated on TSMC’s second-generation 3nm ‘N3E’ process, which allowed it to stand toe-to-toe with its rivals back then. That said, things might be different with the successor.
Xiaomi may not switch to TSMC’s 2nm process
Multiple reports on the web note that Xiaomi may not switch to TSMC’s 2nm process for the XRING O3 and could utilize the older 3nm ‘N3P’ node. If true, it will not compete with Qualcomm and MediaTek this time, as both will move to the 2nm era. It isn’t clear why Xiaomi is sticking to an older manufacturing process, but it could be because of expensive wafer costs.
Chips like Snapdragon 8 Elite Gen 6 may cost $300, and only if ordered in higher volumes. Given that Xiaomi will only need a smaller batch just for its products, the economics wouldn’t add up. This is just a speculation at this point.
Beyond smartphones
As for the hardware, the recent leak revealed the XRING O3 could get a redesigned architecture. For context, the XRING O1 uses a four-cluster setup: Prime + Titanium + Big + Little. The successor will reportedly drop the extra “big” core cluster and use a combination of Prime, Titanium, and Lite cores. The upcoming chip may reach a 4.05GHz clock speed for its Prime core. It could also bring around 25% GPU improvements.
Beyond smartphones and tablets, Xiaomi’s XRING O3 may also power other products, including automobiles, according to reports on the web. The SoC may open up an ecosystem similar to Apple’s.
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