When it comes to chip production, TSMC has the advantage over Samsung overall, but there is one area where Samsung reportedly reigns supreme, and that’s with the panel-level-packaging technique that it created to help with its chips production processes. TSMC now reportedly wants to take this advantage away from Samsung, and is said to be making that attempts by starting its own panel-level-packaging processes.
Panel-level packaging, or PLP, is how Samsung is currently producing its semiconductor chips. This packaging process sets up chips on a rectangular as opposed to the circular wafers that most companies use. The rectangular shape allows for more space to actually use for chip production. Whereas the circular wafer shape ends up with a little wasted space around the edges that can’t be used. In other words, PLP can allow for a better yield, and thus more chips.
TSMC to remove the Samsung chip advantage with its own PLP process
According to reports from etnews (via SamMobile), TSMC is looking to start mass production of chips via the panel-level-packaging manufacturing technique soon. This change to PLP over the more common wafer process could give TSMC yet another big step up over its competitors. TSMC has used this technology before, and started development with it back in 2024. Though this is later than when Samsung started, which is how Samsung has been able to really pull ahead in this particular area.
Thew report doesn’t specific dates for the mass production but it does give a general time frame. Sometime in 2027 is when TSMC is expected to begin its mass production with the PLP method. That gives Samsung plenty of time to continue producing chips this way without competition from TSMC. Whether or not that helps Samsung in the long run is still unclear. With this being its one major advantage though, Samsung will need to come up with other ways to maintain some form of a lead in this business against TSMC.
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