MediaTek will unveil its Dimensity 9600 chip later this year, marking a leap forward to the 2nm process. This will bring some noteworthy upgrades to the performance. The flagship SoC will power major flagships from Vivo, OPPO, and some others in the latter half of this year. In addition to that, a new leak now suggests that the company is also working on the MediaTek Dimensity 8600, which will reportedly bring big upgrades over the current gen.
New leak claims MediaTek’s Dimensity 8600 will bring major upgrades
The new leak comes from a reliable tipster, Digital Chat Station, who, in a new Weibo post, says that the Dimensity 8600 will bring major upgrades to the upper mid-range segment. This segment typically sees strong demand from price-conscious smartphone buyers worldwide. It will arrive as a follow-up to the MediaTek Dimensity 8500 that powered a handful of phones from brands like POCO, OPPO, and HONOR this year.
The MediaTek Dimensity 8600 could use a 3nm process, marking a solid step up from the prior generation’s 4nm node. This should undoubtedly translate to improved performance, both in day-to-day and gaming. The chip could also be more power-efficient.
Phones with the new chip may debut later this year
Furthermore, the leaker notes that the MediaTek Dimensity 8600 will come with a completely upgraded architecture and manufacturing process. But he doesn’t go in-depth about the new architectural design. The Dimensity 8-series chips were always known for using an all-big core design, so it might be getting an upgrade in this department.
It seems that OPPO, Vivo, Xiaomi, and their sub-brands are already evaluating their new devices with the MediaTek Dimensity 8600. They might launch officially towards the end of this year. However, given the current rising component costs, they might not be very affordable, though. Time will paint a clear picture.
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