This fall, we’re set to get our first crop of 2nm chips from Apple, Qualcomm, and MediaTek. Google is supposedly following suit with the Tensor G7 next year. But what comes after 2nm? Sub-1nm. And TSMC has already begun planning for it.
TSMC, which manufactures chips for almost everyone these days, including Apple, Qualcomm, and MediaTek, is planning to introduce its sub-1nm technology in a few years, with trial production expected to start in 2029.
But, before we get there, TSMC is planning to begin mass production of its .4nm process in 2028. Which TSMC promises will have a 30% improvement in both performance and power efficiency.
TSMC plans to use its Tainan A10 facility for sub-1nm manufacturing
TSMC’s Tainan A10 facility, with its P1-P4 plants, is set to be used to make these sub-1nm chips, with an initial monthly wafer target of 5,000 units.
As expected, demand for AI chips has really overwhelmed TSMC, and that’s forcing the company to make adjustments to meet orders as early as possible. But demand for the iPhone is equally high, so Apple might have to fork over a premium to obtain the initial batches as it has done on previous occasions.
However, Apple still has a long way to go before we get there. As TSMC isn’t expected to start the initial production for another 3 years. And by then, the AI bubble could burst, and it could save Apple a lot of cash.
It wouldn’t be surprising to see Apple and others stick with 2nm chips for a few years before moving to 1.6nm and 1.4nm afterward. After all, we’ve been on 3nm processors for a few years already. This move is going to really push Huawei back, as they’re still using 6nm and 7nm chips in their phones, due to being on the US Entity list.
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